Ukudayiswa kabusha kwe-reflow soldering, ngezinye izikhathi okubizwa ngokuthi ukugeleza kabusha kwe-reflow soldering yezingxenye ezihlukanisiwe, kuyanda.Inqubo yokudambisa ukugeleza kabusha ngembobo iwukusebenzisa ubuchwepheshe be-reflow soldering ukushisela izingxenye ze-plug-in kanye nezingxenye ezimise okukhethekile ngamaphini.Kweminye imikhiqizo efana nezingxenye ze-SMT kanye nezingxenye ezinembobo (izingxenye ze-plug-in) ngaphansi, le nqubo igeleza ingase ithathele indawo ye-wave soldering, futhi ibe ubuchwepheshe bokuhlanganisa i-PCB kusixhumanisi senqubo.Inzuzo engcono kakhulu yokudayiswa kwe-reflow soldering ukuthi ipulaki yembobo yomgodi ingasetshenziswa ukuze kutholwe amandla ahlangene okusebenza angcono kuyilapho kusizakala nge-SMT.

Izinzuzo ze- through-hole reflow soldering uma kuqhathaniswa ne-wave soldering

 

1.Ikhwalithi ye- through-hole reflow soldering yinhle, isilinganiso esibi se-PPM singaba ngaphansi kwama-20.

I-2.Iziphambeko ze-solder joint kanye ne-solder joint zimbalwa, futhi izinga lokulungisa liphansi kakhulu.

Idizayini ye-3.PCB yesakhiwo ayidingi ukucatshangelwa ngendlela efanayo ne-wave soldering.

4.ukugeleza kwenqubo elula, ukusebenza kwemishini elula.

5.Imishini yokugeleza kabusha kwe- through-hole ithatha isikhala esincane, ngoba umshini wayo wokunyathelisa kanye nesithando somlilo sokugeleza kabusha sincane, ngakho-ke indawo encane kuphela.

6.Inkinga ye-Wuxi slag.

7.Umshini uvalwe ngokuphelele, uhlanzekile, futhi awunaphunga endaweni yokusebenzela.

8.Ukuphathwa kwemishini yokugeleza kabusha kwe-hole nokugcinwa kulula.

9.Inqubo yokuphrinta isebenzise ithempulethi yokuphrinta, indawo ngayinye yokushisela kanye nenani lokunamathisela lokuphrinta lingalungisa ngokuvumelana nesidingo.

I-10.Ekugelezeni kabusha, ukusetshenziswa kwesifanekiso esikhethekile, iphuzu le-welding lokushisa lingalungiswa njengoba kudingeka.

Okubi kokudayiswa kwe- through-hole reflow soldering uma kuqhathaniswa ne-wave soldering:

I-1.Izindleko ze- through-hole reflow soldering ziphakeme kunalezo ze-wave soldering ngenxa ye-solder paste.

Inqubo yokugeleza kabusha kwe-2.through-hole kufanele yenziwe isifanekiso esikhethekile, sibize kakhulu.Futhi umkhiqizo ngamunye udinga isethi yawo yesifanekiso sokuphrinta nesifanekiso sokugeleza kabusha.

3.Isithando somlilo sokugeleza kwembobo singalimaza izingxenye ezingakwazi ukumelana nokushisa.

Ekukhethweni kwezingxenye, ukunakwa okukhethekile ezingxenyeni zepulasitiki, njengama-potentiometers nokunye ukulimala okungenzeka ngenxa yokushisa okuphezulu.Ngokwethulwa kokudayiswa kwe- through-hole reflow soldering, i-Atom ithuthukise izixhumi eziningi (uchungechunge lwe-USB, uchungechunge lwe-Wafer... njll.) zenqubo yokudambisa ukugeleza kabusha kwe- through-hole.